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Semiconductor industry
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 Semiconductor produce process include crystal circle making,crastal circle testing,chip packing and ending test .after encapsulation,its need a series of other process.such as:Post Mold CureTrim&FormPlating and printing process etc. Typical encapsulation process is scribing/Loading/ bonding/Sealing/edging / electroplating/printing/ tendon-cut and molding/ inspection/testing/shipping.In the whole manufacturing ,  sputtering process was existed in Crystal making and chip packaging。

  APG in Semiconductor  indusrty to provide target material basically has

Type Item Descripition Purity Process

Pure 

material Targets


Cu

acc.to

 customer

require


99.999% Melting
SS / Melting
Ti 99.99%
Melting
Au 99.99%
Melting
Ni 99.99%
Melting
C 99.99%
sintering
Si 99.999%
Crystal pullingSprayingsintering






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